Siemens and nVent are collaborating to develop a liquid cooling and power reference architecture for hyperscale AI workloads.
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...
G RedCap delivers the reliable, energy-efficient connectivity needed to prevent downtime, power automation and help factories ...
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Breakthrough 3D wiring architecture enables 10,000-qubit quantum processors
The novel 3D wiring architecture and chip fabrication method enable quantum processing units containing 10,000 qubits to fit ...
NVIDIA's Alpamayo-R1 AI model improves how self-driving cars “think” for route planning and other real-time driving decisions.
AMD has brought in former AWS infrastructure executive Arvind Balakumar to lead engineering for its Helios AI server-rack ...
Recent advances in neuroscience, cognitive science, and artificial intelligence are converging on the need for representations that are at once distributed, ...
Management behaviors that foster employee engagement by Paul J. Zak Companies are twisting themselves into knots to empower and challenge their employees. They’re anxious about the sad state of ...
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